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            PMEG2015EH_EJ_3 ? NXP B.V. 2010. All rights reserved. Product data sheet Rev. 03 — 15 January 2010 5 of 9 NXP Semiconductors PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 13. 10. Soldering Fig 4. Package outline SOD123F Fig 5. Package outline SOD323F (SC-90) 04-11-29 Dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 04-09-13 Dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 Table 9. Packing methods The -xxx numbers are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PMEG2015EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG2015EJ SOD323F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F 2.1 1.6 1.6 2.9 4 4.4 1.1 1.2 1.1 (2×) solder lands solder resist occupied area solder paste |